Cutting methods of laser cutting machine
Vaporization cutting
It means that vaporization is the main way to remove the processed material. In the process of vaporization cutting, workpiece surface is heated to vaporization temperature quickly by focused laser beams, forming High pressure steam and spraying outward at supersonic speeds. In the meantime, a hole is formed in the laser active area and laser beams reflex several times in the hole to increase the absorption of laser pump power combiner by material.
When high-pressure vapors spray outward, the melted materials are blown away in the kerf till the workpiece is finally cut. Vaporization cutting needs very high power density, which is eighth power of ten watt above per square centimeter. It is usually applied in low flash point materials and refractory materials.
Reaction Fusion Cutting
When assistant airflow not only blows the melted materials from the kerf but also has thermal reaction with the workpiece, this is the so-called reaction fusion cutting. Gases that can have reaction with workpiece are oxygen or mixture gases containing oxygen. When the surface temperature of workpiece reach to ignition temperature, strong combustion heat release occurs to improve the laser cutting ability.
Combustion heat release of low carbon steel and stainless steel is 60%. And it is about 90% for reactive metals like titanium.
Compared to vaporization cutting and general fusion cutting, reaction fusion cutting need less laser power density. However, reaction fusion cutting may effect the performance of worpiece since the combustion reaction can lead to chemical reaction on materials.
Fusion Cutting
When adding a assistant airflow system coaxial with laser to blow the melted materials away from kerf, this kind of cutting is fusion cutting. In fusion fiber coupler cutting, workpiece needn’t to be heated to vaporization temperature so the required laser power density is reduced greatly.
Laser Scribing
It is mainly used in semiconductor materials, in which laser of high power density make a shallow groove in the semiconductor materials of the workpiece and then makes it crack through mechanistic or vibratory methods. The quality is valued by the surface fragments and size of heat affect area.
Cold Chipping
It is a new processing method, which is put forward along with ultraviolet band superpower excimer laser appeared in recent years. The basic theory is that energy of ultraviolet photons is similar to binding energy of many organic materials; this high-energy photons are used to impact bond organic materials thus make it crack, achieving purpose of cutting. This new technology has promising application future, especially in electron industry.
Thermal Stress Cutting
Mechanism of thermal stress cutting is that laser beams heat an area of fragile material to produce evident temperature gradient. The high surface temperature makes expansion and inner lower temperature hinders expansion, forming pulling stress in the surface and radial crushing stress inside. When the two stresses exceed fracture limit strength of the workpiece, crackle appears. And then the workpiece is broken along the normal direction of the crack. It is suitable for glasses and ceramics.
Conclusion: laser cutting machine is a cutting technology of melting and gasifying surface material through focused energy generated by the use of laser specialties and focused lens. It features good cutting quality, high speed, various cutting material and high efficiency.
About DK Photonics
DK Photonics – www.dkphotonics.com specializes in designing and manufacturing of high quality optical passive components mainly for fiber laser applications such as 1064nm high power isolator, Cladding Power Stripper, Multimode High Power Isolator, pump combiner,1064nm Band-pass Filter,(6+1)X1 Pump and Signal Combiner, PM Circulator, PM Isolator, optical Coupler. More information, please contact us.